5V/ 2×(400A 25A) four output water-cooled rectifier

In the PCB manufacturing process, electroless copper plating is an important step. It is widely used in the following two processes. One is plating onto bare laminate and the other is plating through hole, because under these two circumstances, electroplating cannot or can hardly be carried out. In the process of plating onto bare laminate, electroless copper plating plates a thin layer of copper on the bare substrate to make the substrate conductive for further electroplating. In the process of plating through hole, electroless copper plating is used to make the inner walls of the hole conductive to connect the printed circuits in different layers or the pins of the integrated chips.

The principle of electroless copper deposition is to use the chemical reaction between a reducing agent and a copper salt in a liquid solution so that the copper ion can be reduced to a copper atom. The reaction should be continuous so that sufficient copper can form a film and cover the substrate.

This series of rectifier is special designed for tank and power integration design mode realize free combination and expansion to dual-output or dual-output composite device.

The enclosure is enclosed, the air duct is isolated and sealed. The line board is made by using distinct dip-coating process to improve corrosion resistance. All the internal components are installed on single side and the plug mode is designed for easy maintenance.